3-D integrated circuit assembly employing discrete chips

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor


Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0


357 71, 357 80, 361420, 361416, 361413, H01L 2316, H01L 3902, H01L 2548, H01L 2946




A 3-D IC chip assembly is formed from stacked substrates in which each individual substrate has a plurality of different IC chips retained in respective recesses. Conductive feedthroughs extend through the substrate from the side where the chips are located to the opposite side, with the chips electrically connected to the feedthroughs. An electrical routing network on the opposite side of the substrate from the chips provides desired interconnections between the chips by connecting to the feedthroughs. The routing can be formed by standard photolithographic techniques.

patent: 3757175 (1973-09-01), Kim et al.
patent: 4221067 (1980-09-01), Marken et al.
patent: 4239312 (1989-12-01), Myer
patent: 4275410 (1981-06-01), Grinberg et al.
patent: 4507726 (1985-03-01), Grinberg et al.
patent: 4541035 (1985-09-01), Carlson et al.
patent: 4707859 (1987-11-01), Nudd et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4901136 (1990-02-01), Neugebauer et al.
R. O. Carlson et al, "A High Density Copper/Polyimide Overlay Interconnection", Eighth International Electronics Packaging Conference, Nov. 7-10, 1988.
"GE Method overcomes previous wafer-scale integration problems", E. J. Lerner, Research & Development Magazine, 10/85, pp. 51-52.
"High Density Overlay for Bare Chip Interconnect", J. E. Kohl, 1988 GOMAC Proceedings, pp. 445-448.


Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.


3-D integrated circuit assembly employing discrete chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with 3-D integrated circuit assembly employing discrete chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and 3-D integrated circuit assembly employing discrete chips will most certainly appreciate the feedback.

Rate now


Profile ID: LFUS-PAI-O-135728

All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.