Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
357 71, 357 80, 361420, 361416, 361413, H01L 2316, H01L 3902, H01L 2548, H01L 2946
A 3-D IC chip assembly is formed from stacked substrates in which each individual substrate has a plurality of different IC chips retained in respective recesses. Conductive feedthroughs extend through the substrate from the side where the chips are located to the opposite side, with the chips electrically connected to the feedthroughs. An electrical routing network on the opposite side of the substrate from the chips provides desired interconnections between the chips by connecting to the feedthroughs. The routing can be formed by standard photolithographic techniques.
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Garvin Hugh L.
Little Michael J.
Denson-Low W. K.
Duraiswamy V. D.
Hughes Aircraft Company
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