3D multi-layer heat conduction diffusion plate

Details 3D multi-layer heat conduction diffusion plate 3D multi-layer heat conduction diffusion plate

2005-05-11

2008-10-14

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080200, C165S080300, C165S185000, C257S707000, C257S713000, C257S720000, C361S705000, C361S708000, C419S023000, C428S313500, C428S610000

Reexamination Certificate

active

07436669

ABSTRACT:
A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can dissipate heat to a surrounding environment. A soft and bendable material capable of transmitting electrical signals or a fiber glass material capable of transmitting signals can be affixed on an upper and lower surface of the aforementioned super conduction diffusion plate. A micro-porous air-permeable ceramic plate having a high thermal conductivity, which is provided with irregularly arranged air-permeable holes can also be affixed to the aforementioned super conduction diffusion plate, so as to allow air to quickly conduct heat energy to the surrounding environment.

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patent: 2006/0000591 (2006-01-01), Adams et al.

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