One layer spider interconnect
One-sided circuit board for multi-layer printed wiring...
Optimal PCB routing methodology for high I/O density interconnec
Optimal PWA high density routing to minimize EMI substrate coupl
Optimization of routing layers and board space requirements...
Optimization of routing layers and board space requirements...
Optimized conductor routing for multiple components on a...
Optimizing PCB power and ground connections for lead free...
Organic substrate (PCB) slip plane "stress deflector" for flip c
Origami composite EMI/TEMPEST proof electronics module
Orthogonal electrical connection using a ball edge array
Oscillator attachment structure preventing interference by...