Origami composite EMI/TEMPEST proof electronics module

Details Origami composite EMI/TEMPEST proof electronics module Origami composite EMI/TEMPEST proof electronics module

1988-12-29

1990-05-01

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 35R, 361398, 361424, H05K 100

Patent

active

049220594

ABSTRACT:
An origami printed circuit board comprises a rigid printed circuit board having a flexible conducting back secured to the bottom of the circuit board. The flexible back is constructed of alternating layers of flexible dielectric and conducting layers bonded together, where the conducting layers may include copper. The circuit board is then grooved in a predetermined manner with the grooves extending through the rigid circuit board, but not extending into the flexible conducting back. The entire circuit board/flexible back is then folded along the grooves in origami fashion to form an enclosure, or other designed shape, with the flexible back forming the outer walls of the shape. By coupling the electronic elements of the circuit board to the conducting layers of the flexible back, the flexible conducting back includes electronic circuit printed interconnections on the rigid board. A bottom conducting layer of the flexible back may be uncoupled to the electronic elements of the circuit board. When the origami printed circuit board is folded into shape, the bottom layer forms the board's outer wall and creates an EMI/TEMPEST shield. The shield also isolates RF frequency emissions.

REFERENCES:
patent: 3816911 (1974-06-01), Knappenberger
patent: 4152671 (1979-05-01), Tuma et al.
patent: 4394707 (1983-07-01), Consoli
patent: 4703984 (1987-11-01), Mitchell, Jr.
patent: 4792879 (1988-12-01), Bauknecht et al.

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