Organic substrate (PCB) slip plane "stress deflector" for flip c

Details Organic substrate (PCB) slip plane "stress deflector" for flip c Organic substrate (PCB) slip plane "stress deflector" for flip c

1996-09-26

1998-09-08

Kincaid, Kristine L.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361795, H05K 103

Patent

active

058047719

ABSTRACT:
A flip chip integrated circuit package which provides stress relief for the solder bumps of the package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is attached to a plurality of bond pads of the substrate by a number of corresponding solder bumps. The substrate has a first layer that is attached to a second layer. An area that is located between the layers and adjacent to the bond pads is left unattached so that a portion of the first layer can move independent of the remaining portion of the substrate. The unattached area allows the integrated circuit to "float" and expand at a different rate than the substrate when the package is thermally cycled.

REFERENCES:
patent: 4847136 (1989-07-01), Lo
patent: 5367435 (1994-11-01), Andros et al.
patent: 5386341 (1995-01-01), Olson et al.

Affiliated with

Also associated with

Rating

Organic substrate (PCB) slip plane "stress deflector" for flip c does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Organic substrate (PCB) slip plane "stress deflector" for flip c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Organic substrate (PCB) slip plane "stress deflector" for flip c will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1283640