Process for manufacturing semiconductor device

Details Process for manufacturing semiconductor device Process for manufacturing semiconductor device

2006-08-15

2006-08-15

Smith, Bradley K. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C438S065000, C257SE31127, C257S680000

Reexamination Certificate

active

07091585

ABSTRACT:
A process for fabricating a semiconductor device is provided. The process integrates a cutting film process into the front-end of semiconductor process. The cutting film is directly formed on the curved surface of the micro-lens or a passivation layer is formed on the micro-lens before covering the passivation layer with the cutting film. In addition to micro-particle contamination due to sawing, the process is able to simplify chip packaging and reduce the size of a photosensitive module.

REFERENCES:
patent: 4827118 (1989-05-01), Shibata et al.
patent: 6249034 (2001-06-01), Li
patent: 6534340 (2003-03-01), Karpman et al.

Affiliated with

Also associated with

Rating

Process for manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3653755