Package and method for assembly of infra-red imaging devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

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Details

257692, 257693, 257698, 257700, 257701, 257704, 257707, 257434, 437203, 437209, 437214, 437215, H01L 2302, H01L 2144

Patent

active

053492340

ABSTRACT:
Apparatus and a method for the packaging of semiconductor chips to simplify assembly while improving thermal dissipation from the chip and reducing stress in the chip due to differential thermal expansion between the chip and its package as they are cycled over a temperature range are disclosed. An adhesive tape covers an active area of the chip and leaving bonding pads on the chip exposed through a recess in the adhesive tape. A body with a similar recess supports the other side of the tape. Wire bonds are made in the recess to connect bonding pads on the body to the chip. A lid covers the recess to protect the wire bonds.

REFERENCES:
patent: 4762983 (1988-08-01), Oogita et al.
patent: 4824511 (1989-04-01), Hartman et al.
patent: 4953001 (1990-08-01), Kaiser
patent: 5025306 (1991-06-01), Johnson
patent: 5103290 (1992-04-01), Temple et al.

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