Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
Inventor
active
Chip package and package process thereof
Chip package with a ring having a buffer groove that...
Contact sensor package structure
Semiconductor package
Semiconductor package structure
No associations
LandOfFree
Yung-Li Lu does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Yung-Li Lu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Yung-Li Lu will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2964865