Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-10-24
2006-10-24
Nguyen, Cuong (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S777000, C257S778000, C257S780000
Reexamination Certificate
active
07126221
ABSTRACT:
A semiconductor package comprising a substrate and a semiconductor device disposed on the substrate by flip-chip bonding. The present invention is characterized by a connection structure disposed between the semiconductor device and the substrate that extends along the periphery of the bottom surface of the semiconductor device. As a result, it can preferably provide additional mounting support between the two. The connection structure can be formed from cured adhesive. The present invention also provides a method of manufacturing the semiconductor package.
REFERENCES:
patent: 6400033 (2002-06-01), Darveaux
patent: 6570259 (2003-05-01), Alcoe et al.
Chu Chi-Chih
Lee Shih-Chang
Lu Yung-Li
Weng Gwo-Liang
Advanced Semiconductor Engineering Inc.
J.C. Patents
Nguyen Cuong
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