Contact sensor package structure

Details Contact sensor package structure Contact sensor package structure

2006-10-17

2006-10-17

Lee, K. (Department: 2832)

Electricity: circuit makers and breakers

Capacitive switch

C200S512000, C345S173000, C428S408000, C428S702000

Reexamination Certificate

active

07122757

ABSTRACT:
A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.

REFERENCES:
patent: 5239152 (1993-08-01), Caldwell et al.
patent: 5610380 (1997-03-01), Nicolaisen
patent: 6224952 (2001-05-01), Itoh
patent: 6265070 (2001-07-01), Itoh
patent: 6343519 (2002-02-01), Callicott et al.
patent: 6380497 (2002-04-01), Hashimoto et al.
patent: 6639163 (2003-10-01), Fukui et al.

Affiliated with

Also associated with

Rating

Contact sensor package structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Contact sensor package structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Contact sensor package structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3694760