Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
Inventor
active
Borderless contact
Dual damascene interconnect process with borderless contact
Low capacitance bipolar junction transistor and fabrication proc
Method and system for bonding 3D semiconductor devices
Method to reduce a reverse narrow channel effect for MOSFET...
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Profile ID: LFUS-PAI-P-469922