4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Yu-Ting Lai

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Ball grid array semiconductor package and method of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Chip carrier for accommodating passive component

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Chip carrier, semiconductor package and fabricating method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Conductive trace structure and semiconductor package having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Substrate for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Profile ID: LFUS-PAI-P-2543892

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