4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Yong-Hwan Kwon

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Circuit film with bump, film package using the same, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Method for manufacturing tape wiring board

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Method of forming redistribution bump and semiconductor chip...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Methods of forming a compound semiconductor device including...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor
Reexamination Certificate

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Stack type semiconductor chip package having different type...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2936829

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