Method for manufacturing tape wiring board

Details Method for manufacturing tape wiring board Method for manufacturing tape wiring board

2007-11-27

2007-11-27

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S829000, C029S830000, C029S831000, C029S849000, C174S261000, C264S104000, C438S652000

Reexamination Certificate

active

11086614

ABSTRACT:
A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern, thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate fine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

REFERENCES:
patent: 2963748 (1960-12-01), Young
patent: 3340606 (1967-09-01), Anderson et al.
patent: 4302501 (1981-11-01), Nagashima
patent: 4327124 (1982-04-01), DesMarais, Jr.
patent: 4614837 (1986-09-01), Kane et al.
patent: 5259926 (1993-11-01), Kuwabara et al.
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patent: 6547995 (2003-04-01), Comb
patent: 2003-331662 (2003-11-01), None
patent: 2002-0095505 (2002-12-01), None
patent: 2003-0019977 (2003-03-01), None
English language abstract of Korean Publication No. 2002-0095505.
English language abstract of Korean Publication No. 2003-0019977.
English language abstract of Japanese Publication No. 2003-331662.

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