4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

Wing Keung Lam

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Ball grid array package and process for manufacturing same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Ball grid array package that includes a collapsible spacer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Ball grid array package that includes a collapsible spacer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Ball grid array package with improved thermal characteristics

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate

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Die-up tape ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2388955

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