4. Metal fusion bonding
  5. Process
  6. Using only pressure

William Tze-You Chen

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Bump and fabricating process thereof

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of forming a solderless electrical connection with a wire

Metal fusion bonding – Process – Using only pressure
Patent

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Miniaturized chip scale ball grid array semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Overmolded optical package

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Protective cover plate for flip chip assembly backside

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Profile ID: LFUS-PAI-P-936621

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