Method of forming a solderless electrical connection with a wire

Details Method of forming a solderless electrical connection with a wire Method of forming a solderless electrical connection with a wire

1996-05-31

1998-01-20

Heinrich, Samuel M.

Metal fusion bonding

Process

Using only pressure

22818022, 228191, 29832, H05K 332

Patent

active

057093369

ABSTRACT:
A dendrite surface is provided on each of the electrical contacts of a substrate, such as a test board, chip carrier, or printed wiring board. The electrical contacts on the substrate are arranged in a mirror image of the input/output pads on a wirebond chip from which the wire leads have been removed from, or not initially provided on, each of the input/output pads. The wirebond chip is aligned with the substrate, and the respective contact brought into electrical communication with each other. The wirebond chip may be removed after testing or other temporary attachment purpose, or permanently encapsulated with at least a portion of the substrate in a permanent assembly. The present invention permits wirebond chips to be selectively attached temporarily or permanently, i.e., have a pluggable capability, as well as the ability to allow a full array of I/O pad design.

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U.S. Patent Application Serial No. 08/360,919, filed Dec. 21, 1994 (IBM Docket EN9-94-088).
U.S. Patent Application Serial No. 08/360,920, filed Dec. 21, 1994 (IBM Docket EN9-94-087).

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