Overmolded optical package

Details Overmolded optical package Overmolded optical package

2007-04-03

2007-04-03

Nadav, Ori (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S434000, C257S680000, C257S790000

Reexamination Certificate

active

10667605

ABSTRACT:
An optical semiconductor package includes a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant. The chip is disposed on the substrate and has an optical element. The bonding wires are used for electrically connecting the chip to the substrate. The window is supported on the supporter and positioned over the optical element of the chip. The encapsulant is overmolded on the substrate for fixing the window and encapsulating the chip and the bonding wires.

REFERENCES:
patent: 4732042 (1988-03-01), Adams
patent: 4838089 (1989-06-01), Okada et al.
patent: 5544529 (1996-08-01), Mitani et al.
patent: 5897338 (1999-04-01), Kaldenberg
patent: 6191359 (2001-02-01), Sengupta et al.
patent: 6266197 (2001-07-01), Glenn et al.
patent: 6825551 (2004-11-01), Do Bento Vieira
patent: 2002/0070464 (2002-06-01), Frezza
patent: 2004/0017002 (2004-01-01), Siegel et al.
patent: 2004/0041221 (2004-03-01), Boon et al.

Affiliated with

Also associated with

Rating

Overmolded optical package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Overmolded optical package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Overmolded optical package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3742402