4. Electric lamp and discharge devices
  5. With luminescent solid or liquid material
  6. Solid-state type

Tzu-Han Lin

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active

Bump structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Electronic assembly for image sensor device

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Electronic assembly for image sensor device

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Electronic device package with electromagnetic compatibility...

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Image sensor package and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2175119

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