Electronic device package with electromagnetic compatibility...

Details Electronic device package with electromagnetic compatibility... Electronic device package with electromagnetic compatibility...

2011-06-21

2011-06-21

Sandvik, Benjamin P (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S098000, C257S099000, C257S435000, C257S437000, C257S660000, C257SE23114, C257SE23116, C438S025000, C438S029000

Reexamination Certificate

active

07964936

ABSTRACT:
Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.

REFERENCES:
patent: 2003/0223008 (2003-12-01), Kim et al.
patent: 2005/0024521 (2005-02-01), Chen
patent: 2006/0083948 (2006-04-01), Kawaguchi et al.
patent: 2008/0099900 (2008-05-01), Oganesian et al.
patent: 2008/0164550 (2008-07-01), Chen et al.
patent: 2008/0239519 (2008-10-01), Lin
patent: 2008/0284897 (2008-11-01), Lv

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