Electronic assembly for image sensor device

Details Electronic assembly for image sensor device Electronic assembly for image sensor device

2007-11-23

2010-11-09

Stark, Jarrett J (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257SE31127

Reexamination Certificate

active

07829966

ABSTRACT:
An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.

REFERENCES:
patent: 5274456 (1993-12-01), Izumi et al.
patent: 2002/0139977 (2002-10-01), Bae et al.
patent: 2007/0045515 (2007-03-01), Farnworth et al.
patent: 2008/0164550 (2008-07-01), Chen et al.

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