Image sensor package and fabrication method thereof

Details Image sensor package and fabrication method thereof Image sensor package and fabrication method thereof

2011-03-01

2011-03-01

Huynh, Andy (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C438S051000, C438S064000, C438S106000, C438S116000, C257SE21499

Reexamination Certificate

active

07898070

ABSTRACT:
The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.

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patent: 2004/0137723 (2004-07-01), Noma et al.
patent: 2005/0194670 (2005-09-01), Kameyama et al.
patent: 2006/0261340 (2006-11-01), Farnworth et al.
patent: 1409869 (2003-04-01), None
patent: 1577875 (2005-02-01), None
patent: 2726120 (2005-09-01), None

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