4. Semiconductor device manufacturing: process
  5. Making field effect device having pair of active regions...
  6. Having insulated gate

Tzong-Sheng Chang

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Bond pad scheme for Cu process

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Bond pad scheme for Cu process

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Fabrication process for MOSFET devices and a reproducible capaci

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent

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Fabrication process for MOSFET devices and a reproducible capaci

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent

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Method for making improved polysilicon FET gate electrode struct

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Profile ID: LFUS-PAI-P-170199

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