4. Optics: measuring and testing
  5. Position or displacement

Tung-Hsien Hsieh

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Method for fabricating QFN semiconductor package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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QFN semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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QFN semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Semiconductor flip chip package utilizing wire bonding for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Static/dynamic multi-function measuring device for linear unit

Optics: measuring and testing – Position or displacement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3237513

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