Method for fabricating QFN semiconductor package

Details Method for fabricating QFN semiconductor package Method for fabricating QFN semiconductor package

2010-07-21

2011-10-18

Dang, Phuc (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S123000, C438S126000, C257S673000, C257S676000

Reexamination Certificate

active

08039319

ABSTRACT:
A method for making a quad flat non-lead (QFN) semiconductor package includes half etching a first side of a carrier to form top portions of a lead array and a die attach surface of a die attach pad, wherein the lead array includes at least one inner terminal lead disposed adjacent to the die attach pad, at least one extended, outer terminal lead disposed along periphery of the QFN semiconductor package, and at least one intermediary terminal disposed between the inner terminal lead and the extended, outer terminal lead, wherein the intermediary terminal is disposed between the inner terminal lead and the extended, outer terminal lead.

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