Semiconductor flip chip package utilizing wire bonding for...

Details Semiconductor flip chip package utilizing wire bonding for... Semiconductor flip chip package utilizing wire bonding for...

2009-11-19

2011-12-27

Ha, Nathan (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23151

Reexamination Certificate

active

08084853

ABSTRACT:
This invention provides a semiconductor flip chip package including a carrier substrate and a flip chip mounted on the carrier substrate. The flip chip comprises a first input/output (I/O) pad and a second I/O pad on an active surface of the flip chip, wherein a switching between the first I/O pad and the second I/O pad is implemented by wire bonding.

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