Toshio Hatsuda

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Bonding structure of thermal conductive members for a multi-chip

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent

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Heat sinks and semiconductor cooling device using the heat sinks

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Lead frame and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reissue Patent

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Lead frame and semiconductor device

Patent

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Liquid impingement cooling module for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Profile ID: LFUS-PAI-P-211193

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