Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1991-10-04
1994-11-15
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 257714, H05K 720
Patent
active
053654005
ABSTRACT:
Disclosed are heat sinks particularly effective in cooling semiconductors of a high heat dissipating density and including a multiplicity of tabular fins laminated via spacers and having through-holes pierced in their central parts, the holes admitting introduction of cooling fluids which radially flow in between the fins. The cooling fluids are supplied to the respective heat sinks attached to the multiplicity of semiconductors mounted on a board. In a specific form of the invention, the semiconductor cooling device has a heat sink provided with parallel tabular internal fins and a cooling fluid nozzle having an elongated opening substantially orthogonal to the fins, the nozzle being disposed to span over the parallel tabular fins substantially at longitudinal mid portions of these fins, so that the cooling fluid is evenly distributed from the mid portions of the fins to both longitudinal ends of the fins.
REFERENCES:
patent: 4682651 (1987-07-01), Gabazda
patent: 4686606 (1987-08-01), Yamada et al.
Ashiwake Noriyuki
Daikoku Takahiro
Hatsuda Toshio
Kobayashi Satomi
Zushi Shizuo
Hitachi , Ltd.
Thompson Gregory D.
LandOfFree
Heat sinks and semiconductor cooling device using the heat sinks does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sinks and semiconductor cooling device using the heat sinks, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sinks and semiconductor cooling device using the heat sinks will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1102186