Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1992-06-24
1993-12-14
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257715, 257721, 361689, 361699, 174 151, 165 804, 16510433, H01L 2302, H01L 2504
Patent
active
052705722
ABSTRACT:
A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.
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Heat Transfer in Electronics, 1989 ASME Htd vol. 111, pp. 79-87.
Ashiwake Noriyuki
Daikoku Takahiro
Hatada Toshio
Hatsuda Toshio
Inouye Hiroshi
Hille Rolf
Hitachi , Ltd.
Ostrowski David
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