Lead frame and semiconductor device

Details Lead frame and semiconductor device Lead frame and semiconductor device

1988-02-22

1990-07-17

Hille, Rolf

357 70, H01L 2348, H01L 2312

Patent

active

049424521

ABSTRACT:
A lead frame and a semiconductor device wherein a through hole is formed in the center of a semiconductor chip-mounting surface of a chip pad at the center of the lead frame, the through hole being tapered or being one which corresponds to a surface area that is greater on the surface of the chip-mounting surface of the chip pad than on the surface of the side opposite to the chip-mounting surface thereof. This prevents the occurrence of cracks in the sealing plastic portion in the step of reflow soldering of the lead frame to the substrate.

REFERENCES:
patent: 4048438 (1977-09-01), Zimmerman
patent: 4523218 (1985-06-01), Kato
patent: 4589010 (1986-05-01), Tateno et al.
patent: 4797726 (1989-01-01), Manabe

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