Bonding structure of thermal conductive members for a multi-chip

Details Bonding structure of thermal conductive members for a multi-chip Bonding structure of thermal conductive members for a multi-chip

1992-04-22

1994-01-04

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165185, 257707, 361385, H05K 720

Patent

active

052765865

ABSTRACT:
A semiconductor module comprises a substrate, a plurality of semiconductor chips mounted on the substrate, a plurality of heat conduction members mounted on the back surfaces of the plurality of semiconductor chips, respectively, and a cooling jacket, on which the plurality of heat conduction members are bonded with heat conductive bonding agent, sealed with the substrate, wherein, in a surface of each of the plurality of heat conduction members adjacent to the cooling jacket and in a surface of the cooling jacket adjacent to the heat conduction members, around a portion corresponding to the back surface of each of the semiconductor chip is formed a portion which has non-affinity for the heat conductive bonding agent. Further, it is preferred that a reservoir having an affinity for the heat conductive bonding agent and serving to receive an excessive bonding agent is formed around each of the non-affinity portions of the plurality of heat conduction members and the cooling jacket.

REFERENCES:
patent: 4339768 (1982-07-01), Keller
patent: 4346396 (1982-08-01), Carroll, II
patent: 4561011 (1985-12-01), Kohara
patent: 4612601 (1986-09-01), Watari
patent: 4879632 (1989-11-01), Yamamoto
patent: 4924352 (1990-05-01), Septfons

Affiliated with

Also associated with

Rating

Bonding structure of thermal conductive members for a multi-chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding structure of thermal conductive members for a multi-chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding structure of thermal conductive members for a multi-chip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-312147