Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
Inventor
active
Connecting of semiconductor chips to circuit substrates
Electrode bump for flip chip die attachment
High density packaging of solid state devices
Method for creating substrate electrodes for flip chip and other
Method of generating a substrate electrode for flip chip and oth
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Profile ID: LFUS-PAI-P-1009467