Connecting of semiconductor chips to circuit substrates

Details Connecting of semiconductor chips to circuit substrates Connecting of semiconductor chips to circuit substrates

1992-02-21

1992-12-08

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228212, 437211, H01L 2160

Patent

active

051690560

ABSTRACT:
A method and article made by such method are described for connecting electrodes on one face of an integrated circuit semiconductor device with those on a supporting substrate. The method comprises positioning electrodes formed on one face of the device into engagement with electrodes formed on the substrate. A force is applied to press the electrodes together and during application of the force a first adhesive is applied along only a minor portion of two edges of the device. The first adhesive is stiffened to provide a temporary connection of the device and the substrate. A mass of a second adhesive is applied over a face of said device opposite said one face and onto portions of the substrate adjacent the periphery of the device with substantially no adhesive located between the one face of the device and the substrate at a center area of the one face. The second adhesive is hardened to form an adhesive dome that permanently connects the device to the substrate.

REFERENCES:
patent: 3793714 (1974-02-01), Bylander
patent: 4208005 (1980-06-01), Nate et al.
patent: 4314870 (1982-02-01), Ishida et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4749120 (1988-06-01), Hatada
patent: 4929965 (1990-05-01), Fuse
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 5012969 (1991-05-01), Hatada et al.

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