Electrode bump for flip chip die attachment

Details Electrode bump for flip chip die attachment Electrode bump for flip chip die attachment

1992-05-21

1993-08-10

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174259, H05K 100

Patent

active

052351408

ABSTRACT:
A large electrode bump is generated on a substrate such as a circuit board. A small electrode bump is then formed on the large bump. Preferably a barrier layer is deposited over the large bump prior to formation of the small bump. In this case the small bump is formed on the barrier layer over the large bump. In one embodiment, the small bump is formed by applying a sacrificial layer on the large bump. A window is created in the sacrificial layer. A spring may optionally be inserted in the window. The window is then filled with a conductive material. Finally, the sacrificial layer is removed to reveal the small bump. In another embodiment, a small bump is formed on a semiconductor die and a larger bump is formed on a substrate. The semiconductor die is mounted on the substrate such that the bump on the die contacts the larger bump.

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patent: 5027188 (1991-06-01), Owada et al.
patent: 5029529 (1991-07-01), Mandigo et al.
patent: 5147084 (1992-09-01), Behun et al.

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