Method of generating a substrate electrode for flip chip and oth

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

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205122, C25D 502

Patent

active

052136760

ABSTRACT:
A method of forming a conductive electrode bump on a first side of a dielectric substrate. The electrode bump is located such that it is in electrical contact with one end of an electrically conductive via passing through the substrate. An electrically conductive test pad, located on a second side of the substrate, is in electrical contact with the opposite end of the via. The method includes the steps of (a)forming a layer of conductive material of generally uniform thickness onto the first side of the substrate, the layer being in a routing pattern for routing electrical signals along the first side; and (b)selectively reducing the thickness of the layer in locations defining the routing pattern to a greater extent than in the location of the bump to provide a bump, that extends from the first side at a height greater than the routing pattern.

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patent: 4991000 (1991-02-01), Bone et al.
patent: 5027188 (1991-06-01), Owada et al.

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