4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Takamichi Maeda

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Ceramic plate for supporting a semiconductor wafer

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
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Flat shaped semiconductor encapsulation

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Lead electrode connection in a semiconductor device

Metal fusion bonding – Process – Critical work component – temperature – or pressure
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Lead electrode structure for a semiconductor chip carried on a f

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Method of making a through-hole connector

Metal working – Method of mechanical manufacture – Electrical device making
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Profile ID: LFUS-PAI-P-279127

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