Flat shaped semiconductor encapsulation

Details Flat shaped semiconductor encapsulation Flat shaped semiconductor encapsulation

1980-09-25

1981-11-10

James, Andrew J.

357 72, 357 74, 357 73, H01L 2328, H01L 3902, H01L 2302

Patent

active

043001530

ABSTRACT:
Electrodes are formed on one major surface of a semiconductor chip and electrically connected to lead electrodes carried by a support substrate. A cover plate is fixed to the opposing major surface of the semiconductor chip to determine one major surface of semiconductor device. Remaining surfaces of the semiconductor chip are encapsulated by a resin mold. The cover plate comprises a flexible glass cloth impregnated with half cured epoxy resin.

REFERENCES:
patent: 3192307 (1965-06-01), Lazar
patent: 3206647 (1965-09-01), Kahn
patent: 3325586 (1967-06-01), Suddick
patent: 3388301 (1968-06-01), James
patent: 3417865 (1968-12-01), Suverkropp
patent: 3480836 (1969-11-01), Aronstein
patent: 3484534 (1969-12-01), Kilby et al.
patent: 3570115 (1971-03-01), Barnes
patent: 3622419 (1971-11-01), London
patent: 3745648 (1973-07-01), Wiesner
patent: 4143456 (1979-03-01), Inoue

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