Lead electrode connection in a semiconductor device

Details Lead electrode connection in a semiconductor device Lead electrode connection in a semiconductor device

1979-05-17

1985-08-20

James, Andrew J.

Metal fusion bonding

Process

Critical work component, temperature, or pressure

357 80, 357 65, 2281802, H01L 2348, H01L 2944, H01L 2952

Patent

active

045367868

ABSTRACT:
Raised contacts included within a semiconductor chip are bonded to respective external leads through the use of a bonding tool. The raised contacts and/or the external leads are varied in a fashion depending on their locations on a semiconductor substrate so as to compensate for lack of uniformity of the surface temperature of the bonding tool.

REFERENCES:
patent: 3374537 (1968-03-01), Doelp
patent: 3689803 (1972-09-01), Baker et al.
patent: 3707655 (1972-12-01), Rudolph et al.
patent: 3724068 (1973-04-01), Galli
patent: 3871014 (1975-03-01), King et al.
patent: 3871015 (1975-03-01), Lin et al.
patent: 4010488 (1977-03-01), Gruszka
patent: 4109096 (1978-08-01), Dehaine
Electronics, Film Carrier Technique Automates the Packaging of IC Chips; by Grossman; pp. 89-95, May 1974.
IBM Technical Disclosure Bulletin; Transistor Structure; by Collins; vol. 10, No. 4, Sep. 1967, p. 496.

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