Lead electrode structure for a semiconductor chip carried on a f

Details Lead electrode structure for a semiconductor chip carried on a f Lead electrode structure for a semiconductor chip carried on a f

1977-04-12

1979-04-24

James, Andrew J.

357 67, 357 68, 357 69, 357 71, H01L 2348, H01L 2944, H01L 2952

Patent

active

041515439

ABSTRACT:
A semiconductor device comprises an insulating substrate such as a film carrier having wiring patterns formed thereon, lead electrodes connected to the wiring patterns, and a semiconductor chip bonded to the lead electrodes. The surface of the lead electrodes, to which the semiconductor chip is bonded, is smooth as compared with that of the wiring patterns, thereby ensuring accurate operation of the semiconductor device.

REFERENCES:
patent: 3480836 (1969-11-01), Aronstein
patent: 3724068 (1973-04-01), Galli
patent: 3780352 (1973-12-01), Redwanz
patent: 3781596 (1973-12-01), Galli et al.
patent: 3793714 (1974-02-01), Bylander
patent: 3832769 (1974-09-01), Olyphant et al.
patent: 3968563 (1976-07-01), Hamlin
patent: 4024570 (1977-05-01), Hartmann
patent: 4027236 (1977-05-01), Kummer et al.
patent: 4045863 (1977-09-01), Mitterhummer

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