Ceramic plate for supporting a semiconductor wafer

Details Ceramic plate for supporting a semiconductor wafer Ceramic plate for supporting a semiconductor wafer

1977-12-08

1981-01-27

Van Balen, William J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

228 6A, 228180A, 428304, B32B 300, B32B 326

Patent

active

042475902

ABSTRACT:
A semiconductor wafer is supported by a supporting plate via adhesive in some steps of fabricating a semiconductor device. The supporting plate is a porous ceramic plate impregnated with or painted with resin such as epoxy resin, silicone resin and polyimide varnish. The porous ceramic supporting plate has a low thermal conductivity to ensure stable bonding operation.

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patent: 4020222 (1977-04-01), Kausche et al.
patent: 4021100 (1977-05-01), Giglia

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