Method of making a through-hole connector

Details Method of making a through-hole connector Method of making a through-hole connector

1980-06-27

1983-05-17

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

174 685, 339 17B, H05K 302

Patent

active

043833632

ABSTRACT:
A conductive paste is disposed in a through hole to provide communication between wiring patterns formed on both of the major surfaces of an insulator substrate. Conductive layers integral with the wiring patterns are formed on the both major surfaces of the insulator substrate so that the conductive layers extend across the through hole. The conductive layers make contact with the conductive paste disposed in the through hole and function to enclose the both ends of the conductive paste.

REFERENCES:
patent: Re29284 (1977-06-01), Shaheen et al.
patent: 3040119 (1962-06-01), Granzow
patent: 3077511 (1963-02-01), Bohrer et al.
patent: 3311966 (1967-04-01), Shaheen et al.
patent: 3335489 (1967-08-01), Grant
patent: 3436819 (1969-04-01), Lunine
patent: 3561110 (1971-02-01), Feulner et al.
patent: 3600263 (1971-08-01), Lapitz
patent: 3601523 (1971-08-01), Arndt
patent: 3895435 (1975-07-01), Turner et al.
patent: 4050756 (1977-09-01), Moore
IBM Tech. Discl. Bull. vol. 11, No. 8, Jan. 1969, p. 992 by T. L. Ellis.

Affiliated with

Also associated with

Rating

Method of making a through-hole connector does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a through-hole connector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a through-hole connector will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1561545