4. Metal fusion bonding
  5. Process
  6. Plural joints

Takaji Takenaka

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Circuit board

Electricity: electrical systems and devices – Miscellaneous
Patent

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Electronic circuit device provided with a ceramic substrate havi

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Electronic circuit device, method of connecting with solder and

Metal treatment – Stock – Ferrous
Patent

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Heat transfer apparatus

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Patent

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Method and apparatus for airtightly packaging semiconductor pack

Metal fusion bonding – Process – Plural joints
Patent

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Profile ID: LFUS-PAI-P-85077

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