Method and apparatus for airtightly packaging semiconductor pack

Details Method and apparatus for airtightly packaging semiconductor pack Method and apparatus for airtightly packaging semiconductor pack

1986-05-30

1989-06-06

Rowan, Kurt

Metal fusion bonding

Process

Plural joints

228 8, 228219, 228121, H01L 2150

Patent

active

048364347

ABSTRACT:
An airtight packaging apparatus for covering with a cap a multichip module having LSI chips mounted on a ceramic substrate and for sealing the cap and substrate by means of solder includes a receptacle for accommodating the multichip module, valves for supplying gas to the receptacle and exhausting the receptacle, a retainer for holding the cap and adjusting the positional relation with respect to the multichip module, and a heater for heating solder of the junction between the multichip module and the cap. After solder has been heated and melted, the multichip module and the cap are sealed to each other.

REFERENCES:
patent: 3392442 (1968-07-01), Napier
patent: 3486223 (1969-12-01), Butera
patent: 3921285 (1975-11-01), Krall
patent: 4077114 (1978-03-01), Sakuma
patent: 4470539 (1984-09-01), Diem

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