Heat transfer apparatus

Details Heat transfer apparatus Heat transfer apparatus

1985-04-24

1986-10-28

Davis,, Jr.,

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

165133, 357 82, 361385, F28D 1500, H01L 2344

Patent

active

046193162

ABSTRACT:
In an apparatus wherein heat generating bodies such as integrated circuit chips are cooled by utilizing boiling of a liquid; a heat transfer apparatus characterized in that a heat conductive member which has a plurality of layers of cavity groups and apertures for bringing the cavity groups into communication is installed on a surface of each of the heat generating bodies.

REFERENCES:
patent: 4203129 (1980-05-01), Oktay et al.

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