Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1990-05-11
1993-09-28
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
420507, 361699, 361774, H05K 720
Patent
active
052491005
ABSTRACT:
Disclosed is an electronic circuit device in which the solder (14) connecting lead pins (6) to the ceramic substrate (2) has a melting point of 356.degree. C. to 450.degree. C. and has a tensile strength being low in such an extent that a thermal contraction stress generated in a cooling process of the solder (14) from the melting point thereof is low and the substrate (2) does not break. The solder (14) is a Au-Ge alloy containing 10-15 wt % of Ge. Electronic circuit devices, which employ the above solder (14) in the connections, are free from damages in the ceramic wiring substrate (2) due to the bonding. Further, when the electronic circuit device undergoes a series of assembly processes after the above bonding, such solder (14) does not melt, and wettability of such solder (14) is favorable.
REFERENCES:
patent: 3645785 (1972-02-01), Hentzschel
patent: 3855693 (1974-12-01), Umbaugh
patent: 4702941 (1987-10-01), Mitchell et al.
patent: 4918811 (1990-04-01), Eichelberger et al.
Ameya Toshinori
Hirota Kazuo
Ohta Toshihiko
Satoh Ryohei
Takenaka Takaji
Hitachi , Ltd.
Thompson Gregory D.
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