Circuit board

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

338307, 338308, 338314, 338195, 174 685, H01H 3736

Patent

active

047259256

ABSTRACT:
A circuit board including resistors on one surface of a board or substrate having through hole conductors arranged in a lattice like fashion. At least one electrode is formed on a surface of the resistors, at least one electrode being formed by removing a portion of a surface of the board or substrate coaxially with the through hole conductors thereby forming substantially disk-shaped resistors.

REFERENCES:
patent: 2382024 (1945-08-01), Priessman
patent: 2777039 (1957-01-01), Thias
patent: 2994846 (1961-08-01), Quinn
patent: 3657692 (1972-04-01), Wormser
patent: 4443691 (1984-04-01), Sauer
Hoffman, H. S. and Stephans, E., "Thin Film Resistor Design", IBM Tech. Discl. Bul., vol. 21, No. 6, 11/78, pp. 2279-2280.
Davis, J. H., Dobson, D. M., "Improved Thermal Characteristics of Interplane Boards", IBM Tech. Discl. Bul., vol. 18, No. 9, 2/76.
Hicks, R. E., Thin-Film Electroplated Funnel Thru-Holes on Polyimide Resin and Laminated Boards, Solid State Technology, Jul. 1973, pp. 36-40.
IBM Technical Disclosure Bulletin, vol. 23, No. 5, Oct. 1980, "MCL Top Surface Metallurgy with Cr/SiO Resistors", J. Gow III and H. S. Hoffman.

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