Electronic circuit device, method of connecting with solder and

Details Electronic circuit device, method of connecting with solder and Electronic circuit device, method of connecting with solder and

1990-08-06

1992-08-04

James, Andrew J.

Metal treatment

Stock

Ferrous

357 67, 148 24, 228 563, H01L 2348, H01L 2946

Patent

active

051363607

ABSTRACT:
An electronic circuit device comprising an electronic part having a gold-plated connecting terminal arranged thereon connected through a solder to a circuit substrate on the predetermined connecting element thereof, in which the connecting terminal of the electronic part and the solder-connected portion of the circuit substrate are constituted by an alloy composition consisting of 1.0 to 8.0 wt. % of Ag, 0.1 to 6.0 wt % of Au and the balance of Sn, is provided. The device is made by using a solder for use in connecting a gold-plated connecting terminal which consists of 1.0 to 8.0 wt % of Ag and the balance of Sn and a method of connecting an electronic part having a gold-plated connecting terminal arranged thereon to a circuit substrate, which comprises the steps of placing the electronic part and the gold-plated connected terminal so as to face each other via a solder and then melting the solder to connect and fix the connecting terminal to the circuit substrate onto the predetermined element thereof, the composition of said solder consisting of 1.0 to 8.0 wt % Ag and the balance of Sn.

REFERENCES:
patent: 3212160 (1965-10-01), Dale et al.
patent: 3986255 (1976-10-01), Mandal
patent: 4872047 (1989-10-01), Fister et al.
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5027189 (1991-06-01), Shannon et al.
"A Guide to Preform Soldering", Alloys Unlimited, Inc., 1959.
"Giometric Optimization of Controlled Collapse Interconnections", IBM Journal, May 1969, pp. 251-265.
"Metallurgical Aspects of Soldering Gold and Gold Plating", Proc. Tech. Programme Intern., 1968, pp. 211-231.
"High Strength, Low Temperature Bonding with Silver-Tin Solders", Welding Journal, Oct. 1979, pp. 838-842.

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