4. Chemistry: electrical and wave energy
  5. Apparatus
  6. Coating, forming or etching by sputtering

Taiwan Semiconductor Manufacturing Co Ltd.

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Apparatus and method for testing conductive bumps

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
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Electrostatic chuck assembly having disassembling device

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field
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Large-scale trimming for ultra-narrow gates

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
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Memory word-line tracking scheme

Static information storage and retrieval – Addressing – Particular decoder or driver circuit
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Method and system for reducing wafer edge tungsten residue...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Profile ID: LFUS-PAI-P-1469969

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