Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
Inventor
active
Integrated circuit package system including honeycomb molding
Integrated circuit package system with package integration
Integrated circuit package system with planar interconnects
Integrated circuit package system with thermo-mechanical...
Integrated circuit package system with triple film spacer...
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Profile ID: LFUS-PAI-P-2283400