Integrated circuit package system including honeycomb molding

Details Integrated circuit package system including honeycomb molding Integrated circuit package system including honeycomb molding

2006-01-12

2010-06-15

Purvis, Sue A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23085, C257SE25023, C438S109000

Reexamination Certificate

active

07737539

ABSTRACT:
An integrated circuit package system including a substrate with a top surface and a bottom surface. Configuring the top surface to include electrical contacts formed between a perimeter of the substrate and a semiconductor die. Aligning over the top surface of the substrate a mold plate with a honeycomb meshwork of posts or a stepped honeycomb meshwork of posts and depositing a material to prevent warpage of the substrate between the top surface of the substrate and the mold plate. Removing the mold plate to reveal discrete hollow conduits formed within the material that align with the electrical contacts.

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